For commercial, government, and academic R&D organizations in need of surface analysis, we perform measurements and/or analysis and solve everything from routine to complex problems.

For semiconductor manufacturers with in-house analysis capabilities, third-party commercial testing laboratories, and instrumentation manufacturers, we offer in-depth analysis and advanced problem-solving.

We are deep experts in laboratory-based and synchrotron-based X-ray photoelectron spectroscopy (XPS), Auger electron spectroscopy (AES), and photoemission electron microscopy (PEEM). These techniques excel for problem-solving involving nanometer-scale lateral patterns, atomically-thin two-dimensional materials, nanostructured and microstructured surfaces, nanometer-scale thin film thicknesses, surface chemical analysis, band alignment at device interfaces, interfacial contact resistance, and more.

We offer more than machine access, including:

• acting as an escalation layer when standard labs fail,
• managing multi-lab workflows for customers,
• extracting the maximum amount of information possible from XPS, AES, and PEEM (via continuous engagement with research communities and literature), and
• engaging in full-chain problem solving across techniques (including and beyond XPS and PEEM).

Click the links above or below to learn more about how XPS, AES, and PEEM can solve semiconductor R&D problems. Contact us using the form below and we will respond within one business day.